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ESD5L5V 23080 IRFZ4 100RJ S06DB HFA3861A E000348 MXTK92TK
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  Datasheet File OCR Text:
 (R) ISO 9001 Registered
Process C3025
CMOS 3m 10 Volt Analog
Electrical Characteristics
T=25oC Unless otherwise noted
N-Channel Transistor Threshold Voltage Body Factor Conduction Factor Effective Channel Length Width Encroachment Punch Through Voltage Poly Field Threshold Voltage Symbol VTN N N LeffN WN BVDSSN VTFP(N) Minimum 0.65 40 3.05 16.5 12 Typical 0.85 0.87 48 3.40 0.550 Maximum 1.05 56 3.75 Unit V V1/2 A/V2 m m V V Comments 100x4m 100x4m 100x100m 100x4m Per side
P-Channel Transistor Threshold Voltage Body Factor Conduction Factor Effective Channel Length Width Encroachment Punch Through Voltage Poly Field Threshold Voltage
Symbol VTP P P LeffP WP BVDSSP VTFP(P)
Minimum -0.7 13 3.00 -16.5 -12
Typical -0.9 0.75 16 3.35 0.8
Maximum -1.1 19 3.70
Unit V V1/2 A/V2 m m V V
Comments 100x4m 100x4m 100x100m 100x4m Per side
Diffusion & Thin Films Well (field) Sheet Resistance N+ Sheet Resistance N+ Junction Depth P+ Sheet Resistance P+ Junction Depth Gate Oxide Thickness Interpoly Oxide Thickness Gate Poly Sheet Resistance Bottom Poly Sheet Res. Metal-1 Sheet Resistance Passivation Thickness
Symbol P-well(f) N+ xjN+ P+ xjP+ TGOX TP1P2 POLY1 POLY2 M1 TPASS
Minimum 3.25 13 50 45 56 15 15
Typical 5.25 20 0.8 80 0.7 48 66 22 22 50 200+900
Maximum 7.25 27 100 51 76 30 30
Unit K/ / m / m nm nm / / m/ nm
Comments P-well
oxide+nit.
Capacitance Gate Oxide Metal-1 to Poly-1 Metal-1 to Silicon Poly-1 to Poly-2
Symbol COX CM1P CM1S CP1P2
Minimum 0.68 0.047 0.027 0.453
Typical 0.72 0.0523 0.30 0.523
Maximum 0.78 0.0575 0.034 0.617
Unit fF/m2 fF/m2 fF/m2 fF/m2
Comments
(c) IMP, Inc.
93
Process C3025
Physical Characteristics
Starting Material Starting Mat. Resistivity Typ. Operating Voltage Well Type Metal Layers Poly Layers Contact Size Metal-1 Width/Space Gate Poly Width/Space P <100> 15 - 25 -cm 10V P-well 1 2 2.0x2.0m 3.5 / 2.5m 3.0 / 3m N+/P+ Width/Space N+ To P+ Space Contact To Poly Space Contact Overlap Of Active Contact Overlap Of Poly Metal-1 Overlap Of Contact Minimum Pad Opening Minimum Pad-to-Pad Spacing Minimum Pad Pitch 3.0 / 3.0m 12m 2.5m 1.5m 1.0m 1.0m 100x100m 5.0m 80.0m
Special Feature of C3025 Process: 10 Volt P-well single metal analog process.
94
C3025-4-98


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